Acmecools Tech. Ltd., a British Virgin Islands, is a leading manufacturer of thermally conductive components. Its temperature (heat) board has been successfully proven to be used in the cloud (high-end server server and graphic card), communications And high-power light-emitting diode (LED) lighting, electric vehicles and solar energy industries, heat dissipation applications can solve the current impact of product reliability and poor performance, can effectively improve its stability, and then introduced into the market.
Here are some examples of LED industry:
As everyone knows, the LED itself generates temperature during operation, and the current packaging characteristics make it difficult for heat to be effectively dissipated. In order to reduce LED thermal exhaustion and extend life, the industry can only rely on large-area heat sinks. The large-area LED heat sink has long been an inevitable bottleneck for LED lighting, but it has also indirectly formed glare and performance defects, and constitutes a hazard to the eyes. Therefore, to solve the above doubts, the design of the heat dissipation module is absolutely the key. With good heat dissipation design, the product can take into account the stable luminous efficiency and quality, thereby reducing thermal exhaustion and improving the life of the product and peripheral components. There are several different interpretations of the heat dissipation module alone, but how to effectively and truly export the high heat of the die, and provide industry standards and specifications, and then lead to design, manufacturing, safety management, etc., is currently the LED industry is eager Looking for.
Because the temperature equalization (heat) plate has excellent temperature uniformity and conduction characteristics, the "point" of high heat flux density can be instantaneously extended to a large heat dissipation area, and the heat is exported through the heat dissipation fins. The principle is nothing more than the capillary structure covering the inner wall, the vacuum chamber and the gas phase change of the liquid substance.
In view of the fact that the average temperature (hot) plate on the market refers to a material that can equalize temperature (Cold Plate, not Vapor Chamber), such as: copper plate, aluminum plate, ceramic plate, ceramic plate, Graphite (Graphite), etc., not the Vapor Chamber (a true heat transfer element with the same XYZ conductivity) as the high-efficiency heat-conducting vacuum element of the true gas-phase heat transfer referred to in this product. In short, the heat dissipation capabilities of various products vary considerably. The launch of this product will truly provide a solution and significantly reduce the consumption of the earth ’s limited resources.
At present, although the heat dissipation and module industry claims to have patents for even temperature (hot) boards, most of them are manufacturing patents. Not only have they failed to pass the test of authoritative certification units at this stage, but they have also failed to achieve the purpose of rapid quantification.
The Vapor Chamber, a high-performance temperature-average (hot) board jointly developed by Extreme Technology and the R & D team in the United States, is characterized by the ability to easily assist electronic products to achieve light, thin, short, and small requirements, and is the world ’s first solderless The production technology of the uniform temperature (hot) plate of the liquid injection tube; in addition to the characteristics of no specific hot zone and directionality, it has the characteristics of customization and easy assembly. Not only is it protected by original patents developed independently, but also tested by authoritative certification agencies at home and abroad, both in terms of price, function and product reliability, it far surpasses the existing secondary products of the same type in the market.
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