Different from the traditional SMD package, the COB package LED is a single or multiple chip package directly on the aluminum substrate, which can enhance the heat dissipation performance of the LED. Due to the low thermal resistance of the COB package, low assembly cost and excellent light uniformity, it has been widely used in the lighting market.
COB light source use precautionsStatic electricity:
This product is sensitive to static electricity, so effective protective measures must be taken when using this product. In particular, the high voltage current generated by static electricity exceeds the maximum rating of the product, which may cause damage to the product or may completely invalidate the product. When customers use the product, they should take measures to prevent static electricity and surge. Grounding resistance ≤ 10 ohms.
Use anti-static wrist straps, anti-static mats, anti-static overalls and work shoes, gloves and anti-static containers are effective measures to prevent static electricity and surge. The soldering iron point should be properly grounded.
welding:
Soldering with a soldering iron:
It is recommended to use a soldering iron of less than 20W, and the temperature of the soldering iron must be kept below 300 °C, and the soldering time should not exceed 3 seconds. Reflow soldering:
(a) It is recommended to set according to the temperature curve in the left figure.
(b) After the welding is completed, the temperature of the product is lowered to room temperature, and the product is carefully handled.
Cleaning:
After soldering, it must be cleaned in accordance with the following conditions. Cleaning agents: isopropyl alcohol or denatured alcohol (above 95 °) Temperature: 50 deg.] C up to 30 seconds or 3 minutes up to 30 deg.] C Ultrasonic cleaning: 300W maximum
something else:
Do not touch the gel part at any time to avoid the product surface being defective or even invalid.
Cree launched XLamp® CXA2011 in 2011, and in October 2012, March 2013, XLamp® CXA1304, CXA1310, CXA1507, CXA1512, CXA1816, CXA1820, CXA1830, CXA1850, CXA2520, CXA2530, CXA2540, CXA2590, CXA3050, The CXA3070 and CXA3590 have a total of 15 COB series products.
The new XLamp® CXA Series COB integrated light source offers many advantages: simple assembly and easy machining, usually with one COB for one fixture; the design of the pad makes it easier and more reliable to solder by hand, eliminating the need for a PCB and avoiding reflow soldering reduce costs; design exactly to the definition of the source size LES Zhaga standard size; for simplified design and lower system cost optimized to provide 5,00 - 10,000 lm luminous flux, high lumen output to meet the bulb Requirements for various applications such as lamps, track lights, downlights, spotlights, outdoor lighting and high ceiling lights. This article focuses on how to properly handle the XLamp® CXA series of high power COB sources and devices containing these LEDs during the manufacturing process.
First, the XLamp® CXA series of high-power COB light source processing considerationsTo ensure proper LED usage, Cree recommends the following requirements when dealing with XLamp CXA series high power COB sources or devices containing the XLamp® CXA series of high power COB sources:
1. Avoid applying mechanical stress on the LED.
2. Never touch the optical surface with your fingers or sharp objects. In the actual operation, when using the handheld XLamp® CXA series COB integrated light source, do not touch the lens or press the lens. Do not touch the lens when handling the XLamp® CXA Series COB integrated light source with tweezers. In order to avoid soiling or damaging the LED surface, thereby affecting the optical performance of the LED.
3. Cree recommends dealing with XLamp®
When the CXA series COB is integrated with the light source, always take appropriate anti-static grounding measures. Such as: electrostatic ring, connect a resistor on the regulated power supply! ! !
4. Cree recommends dealing with XLamp®
Wear powder-free latex gloves when the CXA series COB is integrated with the light source.
Second, XLamp® CXA series COB integrated light source fixed wayTo ensure efficient thermal management of the XLamp® CXA Series COB integrated light source, Cree recommends mounting the XLamp® CXA Series COB integrated light source on a suitably sized heat sink that depends on the drive voltage, current and operating environment. The most common installation method, inserting a spacer of a thermally conductive epoxy or other thermal grease thermal interface material (Thermal Interface Material, TIM) constituted between XLamp® CXA Series COB integrated light source and the heat sink. For optimum heat dissipation, the TIM thickness should be kept to a minimum while ensuring that there are no voids. For CXA15xx, CXA25xx and CXA3050 LED, or other use TIM pad having a reflection action; TIM If darker, light output and luminous efficiency may be slightly reduced. Representative suppliers of thermal interface materials include 3M, GrafTech, Laird, Lord and other suppliers.
The CXA15 and CXA25 and CXA30 series are housed in a ceramic substrate package that can be attached to the heat sink with epoxy or LED connectors. Many manufacturers have developed or are developing connectors to simplify the mechanical and electrical installation of the XLamp® CXA Series COB integrated light source. For example, Molex (180560, 180720,180220) and TE Connectivity (5-2154874-2, 5-2154874-3), IDEAL (50-2001CR, 50-2102CR, 50-2234C), United States up to optical (ZJ017, ZJ018 , ZJ037), etc., have developed connectors for the XLamp® CXA series COB integrated light source.
Thermal grease or thermal paste can achieve good heat conduction. Thermal grease or thermal paste has different cost depending on the thermal conductivity. The curing time is longer, and the LED positioning is not good. Once fixed, it is difficult to replace. The specially designed connectors are easy to assemble, can be electrically connected, have good repeatability, and can replace LEDs at any time, but for different application and design requirements, existing connectors are not completely matched with the design, so these two There are advantages and disadvantages in each way. In the choice, we must consider the cost, practicality and design matching requirements to determine.
The CXA2011 LED can be secured by diagonally two screw holes or by using a connector. When using a screw hole to secure the CXA2011 LED, Cree recommends using a 4th (/40) or M2.5 size screw. Excessive torque can cause damage to the LED array. The proper screw torque depends on a number of factors, including the thickness, size and type of thermal interface material, as well as the flatness of these materials and heat sinks. The mounting screws can withstand a safe torque of approximately 45 N·cm.
XLamp® CXA Series COB Integrated Light Source Soldering InstructionsThe XLamp® CXA Series COB integrated light source is suitable for wire bonding. Cree recommends soldering with a solderable iron with a soldering iron tip size of 1.8 mm. Due to the many variations in the heat sink system, LEDs, solder and torches, Cree does not provide specific soldering recommendations. XLamp® should be made after soldering
The CXA Series COB integrated light source is cooled to room temperature for subsequent processing. Premature processing of the device may result in solder joint damage. Cree recommends not exposing the XLamp® CXA Series COB integrated light source to temperatures above 350 °C. When soldering the wire connector directly to the XLamp® CXA Series COB integrated light source, follow these practices.
1. Solder the contact pads of the XLamp® CXA Series COB integrated light source and apply the solder evenly over the contact pads.
2. Apply the appropriate solder to the wire and solder it to the XLamp® CXA Series COB integrated light source.
3. Ensure that the wires soldered to the XLamp® CXA Series COB integrated source have sufficient strain relief to avoid pulling the pads on the LEDs.
Cree recommends soldering the XLamp® CXA Series COB integrated light source with a “no-clean†solder paste so that there is no need to clean the PCB after reflow soldering. Cree recommends the following solder paste ingredients: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
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