The report said that Apple’s upcoming product is expected to include the new generation of MacBook Air, iPhone4S and iPad3, and will begin purchasing chips in August.
However, Taiwan Semiconductor Manufacturing Co., Ltd., United Microelectronics Corp., and other Taiwanese semiconductor packaging companies all unexpectedly expect wafer growth to decline in the third quarter.
According to an industry observer report, Apple has already completed technical specifications, chip lists, and a series of verification processes for new products, and has already placed orders with suppliers. This may be the key to Taiwan’s semiconductor industry's reversal in the third and fourth quarters.
The report also said that Qualcomm is a major supplier of Apple's mobile phone ICs, and that TSMC and Advanced Semiconductor Engineering Inc hope to receive their IC OEM orders in August or September.
Other potential vendors and products listed in the report include: Chipbond Technology Inc., Ardentek, Renesas, and Texas Instruments.
Ethernet chips from Realtek Semiconductor Corp., NOR flash used by BIOSONIX International for BIOS, readers from Skyworth Group, and power management from Richtek Technology. chip.
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