According to reports recently organized by the American Physicist Organization Network, American scientists have developed a new technology that is expected to significantly enhance the cooling effect of computers and microelectronics equipment. Scientists have applied for a patent for this refrigeration device that can cool electronic chips and hopes to commercialize it as soon as possible.
The cooling device, called "Air Bearing Heat Exchanger," was developed by Jeff Coplo, a researcher at the Department of Energy's Sandia National Laboratory. Coplo said that the latest "air bearing heat exchanger" will greatly reduce the energy consumption of processor chips needed to cool data centers and large-scale computing environments. In the United States, the information technology center's annual electricity bill amounts to billions of dollars, and it continues to grow.
In a conventional CPU cooling device, the thermal bottleneck is an adherent layer attached to the stagnation area of ​​the heat sink. If this "air bearing heat exchanger" is used, heat is effectively transferred from a fixed platform to a rotating device through a narrow air gap. The stagnant boundary layer surrounding the fins suffers from a centrifugal pump effect, resulting in the thickness of the boundary layer being reduced to one-tenth of the normal thickness, which greatly enhances the cooling effect.
In addition, high-speed rotation of the heat transfer fins minimizes heat exchanger fouling problems. The way the redesigned cooling fins pass through the air greatly improves the aerodynamic efficiency and makes the operation very quiet. Scientists have confirmed the cooling effect of the device on a model roughly the same size as a computer's CPU cooling device. Coplo said that this technology also has great potential in personal computer applications.
Coplo pointed out that the cooling equipment can also be applied to other fields such as heating, ventilation and air conditioning, which are very important in thermal management and energy efficiency. If it is finally proved that the air bearing heat exchanger technology can adapt to the size of the cooling equipment, it is expected to bring American electricity Consumption is reduced by more than 7%.
The cooling device, called "Air Bearing Heat Exchanger," was developed by Jeff Coplo, a researcher at the Department of Energy's Sandia National Laboratory. Coplo said that the latest "air bearing heat exchanger" will greatly reduce the energy consumption of processor chips needed to cool data centers and large-scale computing environments. In the United States, the information technology center's annual electricity bill amounts to billions of dollars, and it continues to grow.
In a conventional CPU cooling device, the thermal bottleneck is an adherent layer attached to the stagnation area of ​​the heat sink. If this "air bearing heat exchanger" is used, heat is effectively transferred from a fixed platform to a rotating device through a narrow air gap. The stagnant boundary layer surrounding the fins suffers from a centrifugal pump effect, resulting in the thickness of the boundary layer being reduced to one-tenth of the normal thickness, which greatly enhances the cooling effect.
In addition, high-speed rotation of the heat transfer fins minimizes heat exchanger fouling problems. The way the redesigned cooling fins pass through the air greatly improves the aerodynamic efficiency and makes the operation very quiet. Scientists have confirmed the cooling effect of the device on a model roughly the same size as a computer's CPU cooling device. Coplo said that this technology also has great potential in personal computer applications.
Coplo pointed out that the cooling equipment can also be applied to other fields such as heating, ventilation and air conditioning, which are very important in thermal management and energy efficiency. If it is finally proved that the air bearing heat exchanger technology can adapt to the size of the cooling equipment, it is expected to bring American electricity Consumption is reduced by more than 7%.
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