2013 Gaogong LED CTO Conference Session 2: Localized Packaging Equipment “Noisy Revolution”

[High-tech LED reporter Liu Pingping ] On November 25th, the second session of the 2013 Gaogong LED Conference CTO held in conjunction with the 2013 Gaogong LED Lighting Exhibition was held at the Guangzhou Poly World Trade Center Hall 5 in Guangzhou. Mainly around the "packaging devices, equipment and materials" to discuss, industry veteran Xiao Congqing presided over the meeting.

He Yunbo, general manager of Dazu Optoelectronics, gave a special speech on the theme of “welding wire technology” and shared the technical achievements of Dazu Optoelectronics in this respect.

He Yunbo, general manager of Dazu Optoelectronics



“The wire bonding technology is developed with the continuous evolution of packaging technology. The transformation of wire bonding materials is an important aspect of the development of wire bonding technology. The emergence of palladium-plated copper wire has greatly promoted the development of wire bonding technology and reduced the packaging. Cost." He Yunbo said.

At present, the wire bonding technology has been developed to a higher level, but the requirements for the thin and short package and functional integration of the package have not stopped, and the future welding wire technology will develop to a higher level.

As a domestic packaging equipment supplier, He Yunbo said that providing customers with comprehensive system solutions, improving the technical threshold of products and reducing the procurement cost of equipment will be the development trend of the future packaging equipment industry.

As a packaging supplier of domestic equipment, Feng Baihua, general manager of Sany Lianguang, shared his experience in the work of splitting and braiding equipment. Feng Baihua first analyzed the "process revolution and spectroscopic braiding" and "production revolution and spectroscopic braiding". He believes that process innovation is a complete innovation. “Process is the art of industry, including designing the appearance, reducing noise, simplifying operations, etc.”

Feng Baihua, general manager of Sany Lianguang



"The production revolution is mainly to reduce costs, including labor costs, management costs and post-maintenance costs." Feng Baihua pointed out that it is hoped that through the efforts of the industry, each machine will be networked for remote control in the future.

At the end of the meeting, Zhuo Weihuang, technical director of Huateng Semiconductor, gave a keynote speech on "EMC Packaging Test" to share the solution of Huateng Semiconductor based on EMC test.


Zhuo Weihuang, Technical Director of Huateng Semiconductor


Zhuo Weihuang pointed out that EMC packaging test has the characteristics of high current, high voltage and bottom test. "HuaTeng Semiconductor has specially developed the corresponding test sorting machine according to the characteristics of EMC, which is suitable for the latest HT-7900 test sorting of EMC package. The machine has been mass-produced." Zhuo Weihuang said that this device is also the first test sorting machine for professional EMC packaging. "The launch of this device represents Huateng's technical direction and technical strength. Although the EMC packaging process is still immature, it must be a direction for future LED packaging."

Zhuo Weihuang introduced that the innovation of the new equipment in the test method has broken through the traditional side test method, the probe is designed at the bottom, and the bottom test is a new way. “The new solution has improved at least 50% in test accuracy, test results and test accuracy compared to previous generations, and efficiency has increased by 30%.”

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