Today, embedded system development is often based on a platform model. The MCU platform includes MCUs and related devices (epitaxial devices, supporting devices, etc.), integrated development environments (development boards, development tools, middleware, etc.), and operating systems. When semiconductor manufacturers introduce a new MCU product, they generally have corresponding peripheral devices, integrated development environment and operating system to support.
Therefore, when selecting an MCU platform for embedded system development, engineers should not only consider the performance of the MCU chip itself, but also whether the MCU platform can easily implement code porting and software compatibility, and whether the hardware design can be further optimized. This saves development time and shortens the time to market. If the MCU platform is chosen properly, the design of the product will be half successful.
With the booming development of the Internet of Things industry, there are more and more problems: How can the MCU platform make the developed products better secure and interconnected? There are many different protocol standards in the Internet of Things industry. How to achieve compatibility between different protocol standards, so that the product is more versatile? The demand for low power consumption in portable devices is increasing. How to deal with this challenge by choosing the right MCU platform? 
Industry voice
Multi-protocol wireless SoC helps IoT applications accelerate deployment and update
Øivind Loe, Senior Marketing Manager, Silicon Labs Microcontrollers and Sensor Products
Mainstream wireless technologies in the IoT space include Wi-Fi (802.11), ZigBee and Thread (802.15.4) with mesh networks, and Bluetooth Low Energy (LE). Many proprietary protocols are also widely used in industrial IoT applications, especially in the Sub-GHz band. Each protocol is tailored to specific application needs, but no single protocol provides a versatile, versatile solution. Wi-Fi access points are ubiquitous, providing high bandwidth for applications such as streaming media and security cameras. We see a steady increase in shipments of ZigBee and Thread on the 802.15.4 platform in the home networking market, especially in power-constrained, battery-powered applications. Although there is now a large ZigBee ecosystem, more and more developers are moving Thread-enabled devices to these ecosystems to prepare for future changes.
ZigBee has built a rich "cluster library" or application layer, now called dotdot, that runs on top of Thread to support interoperability between devices and the network. Low-power Bluetooth continues to grow rapidly, thanks to the simplicity of point-to-point connectivity and the ability to connect to mobile devices such as smartphones. The Bluetooth mesh network specification is still in the early stages of adoption, and it remains to be seen how this new network protocol will play a role in the market.
An important new trend in the Internet of Things is the rise of multi-protocol wireless SoCs, which enable dynamic switching between multiple protocols on a single SoC, such as ZigBee and Bluetooth low energy. This multi-protocol solution enables advanced functionality and interoperability of IoT applications without the added complexity and hardware cost of a two-chip architecture, reducing wireless subsystem bill of materials (BOM) cost and size 40%. Dynamic multi-protocol software allows users to deploy, update, control and monitor ZigBee mesh networks directly via Bluetooth using a smartphone app.
Multi-protocol technology also extends ZigBee-based connectable lighting and building automation systems with Bluetooth beacons, making it easier to deploy a scalable, location-based service infrastructure indoors. By adding Bluetooth low energy to the ZigBee mesh network, developers can create next-generation IoT applications that are easier to deploy, use, and update. We believe that this multi-protocol capability will be one of the fastest growing trends next year.
To meet this market need, Silicon Labs offers a combination of wireless Gecko multi-protocol SoCs that support ZigBee, Thread, Bluetooth low energy and private wireless connectivity. In addition to offering a wide range of connectivity options, the wireless Gecko platform allows developers to leverage the same engineering know-how and reuse hardware and software to address different needs across multiple applications. This multi-protocol approach brings agility and efficiency when developing new products.
Reducing current consumption remains the main focus of the portable IoT device market. Ultra-low-power MCUs and wireless SoCs can now dramatically reduce power consumption during chip operation and deep sleep, extending the battery life of networked devices. In order to take full advantage of the current power specifications of today's MCUs and SoCs, developers must consider many factors. A significant way to increase power efficiency is to reduce current consumption while executing code and transmitting or receiving wireless signal packets. These currents should be as low as possible, which will benefit applications that work most of the time. In those scenarios, however, for many networked device applications running on very small batteries, it is important to have their MCUs in as much state as possible.
Sleep current is important, but more important is the ability of the MCU to complete its work in sleep mode. Taking Silicon Labs' Gecko MCU and Wireless Gecko SoC as an example, most of its peripheral functions continue to work even in Deep Sleep mode. These features include multiple analog peripherals such as ADCs, operational amplifiers, DACs, segmented LCD drivers, capacitive touch sensors, communication interfaces, multiple timers, etc., as well as low-power sensor interfaces (LESENSE) and other low-power applications. It is capable of performing sensor monitoring independently and precisely; there is also a Peripheral Reflection System (PRS) that autonomously interconnects different peripherals and supports their interaction in deep sleep mode. In order to maximize the benefits of low-power platforms, the key is to enable them to cope with a wide range of applications, from high-duty-cycle applications where the CPU and RF sections work frequently, to sleep mode for most of the time, while still A dormant application that monitors its environment.
MCU's flexible and secure solution is the top priority for IoT product development
Jeannette Wilson, Marketing Manager, Computer Products, Microchip Technology Inc.
Microcontrollers (MCUs) provide customers with the flexibility to enhance the security of their platforms through software algorithms, key and certificate storage, and data encryption/decryption. At the most basic level, MCUs can use software algorithms to perform symmetric encryption for secure communication. As users become more complex and want to make their connected systems more secure, they can use MCUs such as Microchip's CEC1702 or SAM D51/E54, which now include asymmetric hardware accelerators for public key cryptography, A hash algorithm for authentication and de-cloning and an elliptic curve for encrypting and decrypting data. The hardware crypto accelerator integrated into the MCU runs much faster than the algorithms running in the software, helping to reduce the overall code length.
In addition to validating the system, it is important to ensure that the MCU only executes trusted code and provides a mechanism for secure firmware updates. This is done through a hardware-verified boot process to ensure that the system can only be started with code from an immutable source. In non-writable memory in an MCU, the immutable source is typically non-volatile.
From software solutions such as SSL (Secure Sockets Layer) and TLS (Transport Layer Security) running on MCUs to MCUs and MPUs with advanced hardware encryption, Microchip offers customers a flexible, scalable MCU solution To achieve a secure connection and avoid man-in-the-middle, denial of service and backdoor attacks. Microchip's solution also provides a way for secure firmware updates to protect your system from malware or memory corruption.
Interoperability is not a new issue in the IoT industry. Currently, computers, smartphones, and "objects" use different mechanisms to connect to the Internet. This is one of the main reasons why a flexible security solution is used to meet this changing trend.
Similar to the various IoT standards, security solutions are not static. It is important to be able to create a unique trusted identity that can be securely authenticated and protected. There are different ways to implement this trust, and additional measures can be added based on the level of security required for a particular system.
Essentially, developers can use our scalable, modular solution to help them connect Microchip's hardware and development ecosystem to their applications with little or no overhead.
It is important to choose an MCU that is suitable for your design. In the past, there was a linear relationship between application complexity and power consumption, but now Microchip offers a variety of ultra-low-power product solutions with 8-, 16-, and 32-bit microcontrollers. This allows customers to choose the right MCU to handle application complexity while still maintaining low power consumption. Perhaps the application simply connects an 8-bit or 16-bit microcontroller to the Internet.
To enhance the security of these low-power designs, one option is to use a companion chip such as the ATECC608A, which provides hardware-based secure key storage to ensure products, firmware for product operation, accessories for supporting products, and networks for product connectivity. Nodes are not cloned, forged, or tampered with. Microchip offers an industry-leading suite of proven hardware-based trusted root storage and encryption countermeasures that can be easily addressed even with the most powerful attacks. For higher microcontroller performance, consider using a microcontroller or microprocessor with an integrated cryptographic hardware accelerator. Since the security algorithm executes 5 to 20 times faster on the hardware, it requires less processing power and lower system power consumption.
Editorial perspective
It can be seen that there are several types of problems that engineers should pay special attention to when choosing an MCU platform for embedded development: 1 security when IoT products are interconnected; 2 there are many different standards in the Internet of Things industry, how to achieve standard compatibility, The common agreement is the focus of the designer; 3 also need to understand different standards from a technical point of view, in order to solve some in-depth product problems, the engineer's professional knowledge is relatively high; 4 is low power consumption, More and more products now have extremely high demands on power consumption. The platforms and products of the companies mentioned above are built around these four themes to facilitate engineering.
Major semiconductor manufacturers are building embedded development platforms based on the characteristics of their products, including hardware, software and peripherals, to better accelerate the landing of IoT products and subsequent updates. For example, TI released the SimpleLink platform in 2017, which integrates TI's existing products, including: MSP432 MCU, mainly used for host control; different wireless SoC products, including Bluetooth SoC, MCU CC2640, supports 2.4GHz, dual band CC1350 and Sub 1 GHz CC1310 MCU, as well as WiFi SoC product CC3220. In this way, the platform can be built, and wired connections, wireless connections, and the cloud can all be interconnected.
The future trend is that the embedded development platform can not only fully integrate wired and wireless, but also integrate Ethernet functions for network connection. It can be used as a hub for sensing, connecting to the cloud to transmit data, and providing low product offerings. Power design options. Engineers have more and more optional features in design, and the suitable embedded development platform will make the product design more effective.
2.54mm (0.1") Pitch Female Headers
Overview
The most commonly seen female headers are 2.54mm (0.1") single or double row female/socket headers. These female headers together with its male counterpart are used in connecting Arduino boards and shields together. 2.54mm pitch female sockets/headers are low-profile connectors designed for signal and low power PC board connections when space is at a premium. They have the perfect height for clearing the USB-B connector and great for stacking multiple shields.
Since 2.54mm pitch female header is commonly used in a lot of applications, Scondar offers numerous options for this type of female header. Orientation can either be SMT or THM, single, dual or triple row. Antenk offers 2.54mm pitch female headers in either vertical or right-angle orientation. The pins and blades are also available in various sizes, counts, amperages, and plating.
The 2.54mm can accommodate a maximum current of 3A, with a 30 to 22 AWG wire size, and up to 40-positions. Antenk offers these female headers in high quality and affordable China-quoted price that snuggly fits with the pins of a male header and acts as a receptacle.
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Applications of 2.54mm Pitch Female Headers
Electronics:
LED applications
Arduino boards
Arduino Pro
Arduino Mega
Solar applications
Weighing systems
Appliances:
Air conditioner
Refrigerator
Microwave oven
Washing machine
Water heater
Shower toilet
Washer/Dryer
Stove
Automotive, Heavy Duty Military and Marine
For densely packed equipment requiring weight reduction and downsizing and for tough and harsh conditions.
Vehicle infotainment
Computer peripherals
Battery Connections
Battery connections rely on the ability of the current to pass reliable and solid current. This prevents overheating in the circuit and voltage drop.
Rechargeable battery packs
Battery balancers
Battery eliminator circuits
Medical Diagnostic and Monitoring equipment
Heart monitors
Telecoms
Datacoms
Mount Type: Through-hole vs Surface Mount
At one side of this female header is a series of pins which can either be mounted and soldered directly onto the surface of the PCB (SMT) or placed into drilled holes on the PCB (THM).
Through-Hole (Poke-In)
Best used for high-reliability products that require stronger connections between layers.Aerospace and military products are most likely to require this type of mounting as these products experience extreme accelerations, collisions, or high temperatures.
Useful in test and prototyping applications that sometimes require manual adjustments and replacements.
2.54mm, 1-row vertical female header, 2.54mm, 2-row vertical female header, 2.54mm, 3-row vertical female header, 2.54mm, 1-row right-angle female header and 2.54mm, 2-row right-angle female header, 2.54mm U-
Shaped Female header, 2.54mm U-Shaped Dual Row Female header are examples of Antenk products with through-hole mount type.
Surface-Mount
The most common electronic hardware requirements are SMT.
Essential in PCB design and manufacturing, having improved the quality and performance of PCBs overall.
Cost of processing and handling is reduced.
SMT components can be mounted on both side of the board.
Ability to fit a high number of small components on a PCB has allowed for much denser, higher performing, and smaller PCBs.
2.54mm, 2-row right-angle female header and 2.54mm, 1-row right-angle female header are Antenk`s featured SMT female headers.
Orientation/Pin-Type: Vertical (Straight), Right-Angle and U-Shaped
2.54mm pitch female headers may be further classified into pin orientation as well, such as vertical or straight female header, right-angle female header or U-shaped female header.
Vertical or Straight Female Header Orientation
One side of the series of pins is connected to PCB board in which the pins can be at a right-angle to the PCB surface (usually called "straight" or [vertical") or..
Right-Angle Female Header Orientation
Parallel to the board's surface (referred to as "right-angle" pins).
U-Shaped Female Header Orientation
U-shaped orientation is characterized by the shape of the pins at one side of the header, forming a letter [U". It is often chosen for applications where repeat mating cycles are not required as it can also be used and soldered directly to both PCB's.
Each of these pin-types have different applications that fit with their specific configuration.
Single, Dual or Multiple Number of Rows
For a 2.54mm straight or vertical female header, the standard number of rows that Antenk offers ranges from 1 to 2 rows. However, customization can be available if 3, 4 or n number of rows is needed by the customer. Also, the number of contacts for the single row is about 2-40 pins while for dual row, the number contacts may vary from 2-80 pins.
Pin Material
The pins of the connector attached to the board have been designed with copper alloy. With customer`s demand the pins can be made gold plated.
Custom 2.54mm Pitch Female Headers
Customizable 2.54 mm pitch female headers are also available, making your manufacturing process way faster as the pins are already inserted in the headers, insulator height is made at the right size and the accurate pin length you require is followed.
Parts are made using semi-automated manufacturing processes that ensure both precision and delicacy in handling the headers before packaging on tape and reel.
Tape and Reel Packaging for SMT Components
Antenk's SMT headers are offered with customizable mating pin lengths, in which each series has multiple number of of circuits, summing up to a thousand individual part number combinations per connector series.
The tape and reel carrier strip ensures that the headers are packaged within accurately sized cavities for its height, width and depth, securing the headers from the environment and maintaining consistent position during transportation.
Antenk also offer a range of custom Tape and reel carrier strip packaging cavities.
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ShenZhen Antenk Electronics Co,Ltd , https://www.antenkelec.com