Recently, the semiconductor production capacity of the International Semiconductor Capacity Statistics (SICAS) in the second quarter of 2010 (April to June) was announced. Although some semiconductor manufacturers have begun to increase production investment, but because of the old production line, the wafer processing capacity has not been greatly improved. In this case, as the wafer input amount increases, the overall operating rate of the semiconductor can be said to be more than 95% of the full load. Some even exceeded 98% and were overloaded.
In terms of wafer processing capacity, the overall semiconductor industry decreased by 0.2% year-on-year (YoY), and the chain ratio (QoQ) increased by 0.6%. The overall MOS IC increased by 0.1% year-on-year and 0.6% quarter-on-quarter, continuing to be flat. The fine-grained investment aimed at the transition from the 0.12~0.06μm production line to the 0.06μm production line is very active, but the investment in increasing the wafer processing capacity is slightly inferior: it offsets the decline in wafer processing capacity caused by the abandonment of the old production line. The implementation of the production increase investment, from the perspective of the semiconductor manufacturer's enterprise form, is mainly a silicon foundry manufacturer, mainly from the wafer diameter, mainly for 300mm wafers. The vertically integrated semiconductor manufacturer (IDM) outside the silicon foundry has abandoned the production line below 200mm due to restructuring.
In terms of actual input of wafers, except for some special exceptions, YoY increased by 20~30% and QoQ increased by nearly 10%. Among them, from the perspective of the semiconductor manufacturer's enterprise form, the growth rate of silicon foundry manufacturers is quite significant, and from the perspective of process technology, the growth rate of processes below 60nm is more significant. The investment by silicon foundries increased by 67.8% for YoY and 10.6% for QoQ, reaching 400,200 pieces/week (converted to 200mm wafers). The input of process wafers below 60 nm increased by 13.0% to QKQ, reaching 780,500 wafers/week.
In summary, the semiconductor production line production rate of YoY increased by 18.6 percentage points, QoQ increased by 2.1 percentage points to 95.6%, MOS IC increased by 17.1 percentage points for YoY, and QoQ increased by 2.5 percentage points to 95.7%. Both are over 95%. In particular, the 80nm wafer process and the silicon foundry with a large demand are operating at an overload rate of over 98%.
In terms of wafer processing capacity, the overall semiconductor industry decreased by 0.2% year-on-year (YoY), and the chain ratio (QoQ) increased by 0.6%. The overall MOS IC increased by 0.1% year-on-year and 0.6% quarter-on-quarter, continuing to be flat. The fine-grained investment aimed at the transition from the 0.12~0.06μm production line to the 0.06μm production line is very active, but the investment in increasing the wafer processing capacity is slightly inferior: it offsets the decline in wafer processing capacity caused by the abandonment of the old production line. The implementation of the production increase investment, from the perspective of the semiconductor manufacturer's enterprise form, is mainly a silicon foundry manufacturer, mainly from the wafer diameter, mainly for 300mm wafers. The vertically integrated semiconductor manufacturer (IDM) outside the silicon foundry has abandoned the production line below 200mm due to restructuring.
In terms of actual input of wafers, except for some special exceptions, YoY increased by 20~30% and QoQ increased by nearly 10%. Among them, from the perspective of the semiconductor manufacturer's enterprise form, the growth rate of silicon foundry manufacturers is quite significant, and from the perspective of process technology, the growth rate of processes below 60nm is more significant. The investment by silicon foundries increased by 67.8% for YoY and 10.6% for QoQ, reaching 400,200 pieces/week (converted to 200mm wafers). The input of process wafers below 60 nm increased by 13.0% to QKQ, reaching 780,500 wafers/week.
In summary, the semiconductor production line production rate of YoY increased by 18.6 percentage points, QoQ increased by 2.1 percentage points to 95.6%, MOS IC increased by 17.1 percentage points for YoY, and QoQ increased by 2.5 percentage points to 95.7%. Both are over 95%. In particular, the 80nm wafer process and the silicon foundry with a large demand are operating at an overload rate of over 98%.
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