On July 23, the “Guangdong LED Lighting Supply Chain High-Level Tour Seminar†was held in the Carinna Grand Hotel in Foshan Chancheng District. The seminar aimed at Foshan LED lighting companies eager for cost-effective accessories manufacturers to appeal, integrate the entire industry chain resources, including lamp beads, drive ICs, Power Supplies, professional stores and other high-quality enterprises came to Foshan to facilitate the upgrade of Foshan LED industry.
The seminar was jointly sponsored by Gaogong LED and Foshan Lighting Association, and was strongly supported by local governments, enterprises and the media. It covers key elements such as regional industry supporting enterprises, governments, associations, media and exhibition platforms. Lighting companies offer complete lighting solutions from package to product, policy to promotion, channel to marketing.
The meeting attracted Chen Bin, general manager of Guangdong Zhonglong Transportation, Xu Liancheng, deputy general manager of Guangdong Zhaoxin, Wu Yulin, president of Foshan Lighting Association, and Zhang Hua, secretary-general of the Foshan Lighting Association, and attended the meeting. The foot has doubled.
Zhang Lei, director of strategic research and development at Jingtai Optoelectronics, said that with the continuous advancement of LED packaging technology, COB packaging has attracted more and more attention from enterprises with its unique cost and technical advantages. Compared with the traditional packaging mode, the COB package has the characteristics of small thermal resistance value, high luminous flux density, less glare and uniform illumination. At the same time, the structure is simple, the application cost is low, and the cost performance is high, which is advantageous for reducing the cost of the LED lamp.
Based on COB, Jingtai Optoelectronics successfully developed MLCOB and EMC processes. Compared with the traditional COB, MLCOB adopts a drilling cup, the surface is bright silver, and the optical structure is good; the chip is directly connected to the substrate, and the line length is easy to control; the unique powder-powder process has good light color; automatic molding, simple process The application power is suitable for 3W or more.
EMC products use the new Epoxy material and etching technology, and in the Molding equipment package, a highly integrated frame form. High heat resistance, UV resistance, high integration (1.5W per single), low cost, high luminous efficiency (90-130lm), high index, small size, ultra-thin and small, thickness as low as 0.6mm Can be widely used in backlight and high power lighting.
The seminar was jointly sponsored by Gaogong LED and Foshan Lighting Association, and was strongly supported by local governments, enterprises and the media. It covers key elements such as regional industry supporting enterprises, governments, associations, media and exhibition platforms. Lighting companies offer complete lighting solutions from package to product, policy to promotion, channel to marketing.
The meeting attracted Chen Bin, general manager of Guangdong Zhonglong Transportation, Xu Liancheng, deputy general manager of Guangdong Zhaoxin, Wu Yulin, president of Foshan Lighting Association, and Zhang Hua, secretary-general of the Foshan Lighting Association, and attended the meeting. The foot has doubled.
Zhang Lei, director of strategic research and development at Jingtai Optoelectronics, said that with the continuous advancement of LED packaging technology, COB packaging has attracted more and more attention from enterprises with its unique cost and technical advantages. Compared with the traditional packaging mode, the COB package has the characteristics of small thermal resistance value, high luminous flux density, less glare and uniform illumination. At the same time, the structure is simple, the application cost is low, and the cost performance is high, which is advantageous for reducing the cost of the LED lamp.
Based on COB, Jingtai Optoelectronics successfully developed MLCOB and EMC processes. Compared with the traditional COB, MLCOB adopts a drilling cup, the surface is bright silver, and the optical structure is good; the chip is directly connected to the substrate, and the line length is easy to control; the unique powder-powder process has good light color; automatic molding, simple process The application power is suitable for 3W or more.
EMC products use the new Epoxy material and etching technology, and in the Molding equipment package, a highly integrated frame form. High heat resistance, UV resistance, high integration (1.5W per single), low cost, high luminous efficiency (90-130lm), high index, small size, ultra-thin and small, thickness as low as 0.6mm Can be widely used in backlight and high power lighting.
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