Tiantong shares cooperation with Hefei High-tech Zone LED and new energy industry

[High-tech LED News] Tiantong shares announced that on November 16th, the company and Hefei High-tech Zone Technology Industry Development Management Committee jointly established the "Japan New Energy and High-end Special Equipment Industrial Park" project in Hefei National High-tech Development Zone. Initially reached a cooperation framework agreement.

According to the agreement, Tiantong will take its own major project investment as the forerunner, integrate its own and local resources, use the advantages of the industrial chain to actively carry out investment promotion in Japan and actively participate in investment, and build LED, new energy and special high-end special equipment industry. As the core "Japan's new energy and high-end special equipment industrial park", the total investment will be no less than 4 billion yuan, and the annual output value will exceed 10 billion yuan after completion. It is understood that the one-time overall planning of the project is in place and construction in phases, and the first phase of the project is planned to be completed within two years.

As the other party to the cooperation, Hefei High-tech Zone Technology Industry Development Management Committee will actively cooperate with Tiantong Co., Ltd. to provide land for the construction and development planning of “Japan New Energy and High-end Special Equipment Industrial Park”. At the same time, Hefei High-tech Zone Technology Industry Development Management Committee will provide a public service platform for Tiantong's development of LED, new energy and high-end special equipment manufacturing industries, and provide supporting funds and preferential policies in accordance with relevant policies; Leading LED industry alliance to promote industrial agglomeration.

 

Surface Mounted Components

SMD: It is an abbreviation of Surface Mounted Devices. It is one of Surface Mount Technology (SMT) components. In the initial stage of circuit board production, through - hole assembly is completely manual. When the first automated machines were introduced, they could place some simple pin elements, but complex elements still needed to be placed manually for reflow soldering. Surface Mounted components mainly include rectangular chip components, cylindrical chip components, composite chip components and special-shaped chip components

Surface Mounted Devices

Changzhou Changyuan Electronic Co., Ltd. , https://www.cydiode.com